IDT74LVCH16827APA

IDT74LVCH16827APA

TSSOP, TSSOP56,.3,20

Call for availability

Manufactured by:

INTEGRATED DEVICE TECHNOLOGY

Mfr Part#:  IDT74LVCH16827APA

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP56,.3,20

PACKAGE EQUIVALENCE CODE:  TSSOP56,.3,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  WITH DUAL OUTPUT ENABLE

CONTROL TYPE:  ENABLE LOW

FAMILY:  LVC/LCX/Z

JESD-30 CODE:  R-PDSO-G56

JESD-609 CODE:  E0

LENGTH:  14 MM

LOGIC IC TYPE:  BUS DRIVER

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  IDT74LVCH16827APA

MAX I(OL):  24 MA

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF BITS:  10

NUMBER OF FUNCTIONS:  2

NUMBER OF PORTS:  2

NUMBER OF TERMINALS:  56

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

OUTPUT CHARACTERISTICS:  3-STATE

OUTPUT POLARITY:  TRUE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP56,.3,20

PACKAGE EQUIVALENCE CODE:  TSSOP56,.3,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

PEAK REFLOW TEMPERATURE (CEL):  240

PIN COUNT:  56

POWER SUPPLIES:  3.3 V

PROP. DELAY@NOM-SUP:  4.1 NS

PROPAGATION DELAY (TPD):  5 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.1 MM

SUBCATEGORY:  BUS DRIVER/TRANSCEIVERS

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN85PB15)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  6.1 MM

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