IDT7MB6091S33K
QIP, QI113,1.7/1.9,100Call for availability
Mfr Part#: IDT7MB6091S33K
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QIP
PACKAGE DESCRIPTION: QIP, QI113,1.7/1.9,100
PACKAGE EQUIVALENCE CODE: QI113,1.7/1.9,100
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: IN-LINE
PART PACKAGE CODE: QIP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: TTL COMPATIBLE INPUTS/OUTPUTS
CLOCK FREQUENCY-MAX (FCLK): 33 MHZ
I/O TYPE: COMMON
JESD-30 CODE: R-PQIP-P113
JESD-609 CODE: E0
LENGTH: 73.66 MM
MANUFACTURER: INTEGRATED DEVICE TECHNOLOGY INC
MANUFACTURER PART NUMBER: IDT7MB6091S33K
MEMORY DENSITY: 1.0486 MBIT
MEMORY IC TYPE: CACHE SRAM MODULE
MEMORY WIDTH: 8
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 113
NUMBER OF WORDS: 131.072 K
NUMBER OF WORDS CODE: 128000
OPERATING MODE: SYNCHRONOUS
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 128KX8
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QIP
PACKAGE DESCRIPTION: QIP, QI113,1.7/1.9,100
PACKAGE EQUIVALENCE CODE: QI113,1.7/1.9,100
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: IN-LINE
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: QIP
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 113
POWER SUPPLIES: 5 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 7.747 MM
SUBCATEGORY: SRAMS
SUPPLY CURRENT-MAX: 1.9 MA
SUPPLY VOLTAGE-MAX (VSUP): 5.25 V
SUPPLY VOLTAGE-MIN (VSUP): 4.75 V
SUPPLY VOLTAGE-NOM (VSUP): 5 V
SURFACE MOUNT: NO
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: PIN/PEG
TERMINAL PITCH: 2.54 MM
TERMINAL POSITION: QUAD
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 48.26 MM
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