IDT82V3001APVG

IDT82V3001APVG

SSOP

Call for availability

Manufactured by:

INTEGRATED DEVICE TECHNOLOGY

Mfr Part#:  IDT82V3001APVG

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SSOP

PACKAGE DESCRIPTION:  SSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, SHRINK PITCH

PART PACKAGE CODE:  SSOP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-PDSO-G56

JESD-609 CODE:  E3

LENGTH:  18.415 MM

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  IDT82V3001APVG

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  56

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SSOP

PACKAGE DESCRIPTION:  SSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, SHRINK PITCH

PART PACKAGE CODE:  SSOP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  56

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.794 MM

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TELECOM IC TYPE:  TELECOM CIRCUIT

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN (SN) - ANNEALED

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  635 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  7.5 MM

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