IDTCSPU877ABV

IDTCSPU877ABV

TFBGA, BGA52,6X10,25

Call for availability

Manufactured by:

INTEGRATED DEVICE TECHNOLOGY

Mfr Part#:  IDTCSPU877ABV

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA, BGA52,6X10,25

PACKAGE EQUIVALENCE CODE:  BGA52,6X10,25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

FAMILY:  877

INPUT CONDITIONING:  DIFFERENTIAL

JESD-30 CODE:  R-PBGA-B52

JESD-609 CODE:  E0

LENGTH:  7 MM

LOGIC IC TYPE:  PLL BASED CLOCK DRIVER

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  IDTCSPU877ABV

MAX I(OL):  9 MA

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF INVERTED OUTPUTS:  0

NUMBER OF TERMINALS:  52

NUMBER OF TRUE OUTPUTS:  10

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA, BGA52,6X10,25

PACKAGE EQUIVALENCE CODE:  BGA52,6X10,25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  225

PIN COUNT:  52

POWER SUPPLIES:  1.8 V

QUALIFICATION STATUS:  NOT QUALIFIED

SAME EDGE SKEW-MAX (TSKWD):  40 PS

SEATED HEIGHT-MAX:  1.05 MM

SUBCATEGORY:  CLOCK DRIVERS

SUPPLY VOLTAGE-MAX (VSUP):  1.9 V

SUPPLY VOLTAGE-MIN (VSUP):  1.7 V

SUPPLY VOLTAGE-NOM (VSUP):  1.8 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN63PB37)

TERMINAL FORM:  BALL

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  4.5 MM

FMAX-MIN:  340 MHZ

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