IDTCSPU877ABV
TFBGA, BGA52,6X10,25Call for availability
Mfr Part#: IDTCSPU877ABV
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TFBGA
PACKAGE DESCRIPTION: TFBGA, BGA52,6X10,25
PACKAGE EQUIVALENCE CODE: BGA52,6X10,25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY, THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
FAMILY: 877
INPUT CONDITIONING: DIFFERENTIAL
JESD-30 CODE: R-PBGA-B52
JESD-609 CODE: E0
LENGTH: 7 MM
LOGIC IC TYPE: PLL BASED CLOCK DRIVER
MANUFACTURER: INTEGRATED DEVICE TECHNOLOGY INC
MANUFACTURER PART NUMBER: IDTCSPU877ABV
MAX I(OL): 9 MA
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF FUNCTIONS: 1
NUMBER OF INVERTED OUTPUTS: 0
NUMBER OF TERMINALS: 52
NUMBER OF TRUE OUTPUTS: 10
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TFBGA
PACKAGE DESCRIPTION: TFBGA, BGA52,6X10,25
PACKAGE EQUIVALENCE CODE: BGA52,6X10,25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY, THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
PEAK REFLOW TEMPERATURE (CEL): 225
PIN COUNT: 52
POWER SUPPLIES: 1.8 V
QUALIFICATION STATUS: NOT QUALIFIED
SAME EDGE SKEW-MAX (TSKWD): 40 PS
SEATED HEIGHT-MAX: 1.05 MM
SUBCATEGORY: CLOCK DRIVERS
SUPPLY VOLTAGE-MAX (VSUP): 1.9 V
SUPPLY VOLTAGE-MIN (VSUP): 1.7 V
SUPPLY VOLTAGE-NOM (VSUP): 1.8 V
SURFACE MOUNT: YES
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/LEAD (SN63PB37)
TERMINAL FORM: BALL
TERMINAL PITCH: 650 ΜM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 4.5 MM
FMAX-MIN: 340 MHZ
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