TSI320-L100CE

TSI320-L100CE

HBGA

Call for availability

Manufactured by:

INTEGRATED DEVICE TECHNOLOGY

Mfr Part#:  TSI320-L100CE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HBGA

PACKAGE DESCRIPTION:  HBGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, HEAT SINK/SLUG

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  64

CLOCK FREQUENCY-MAX:  100 MHZ

EXTERNAL DATA BUS WIDTH:  64

JESD-30 CODE:  S-PBGA-B352

LENGTH:  27 MM

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  TSI320-L100CE

NUMBER OF TERMINALS:  352

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HBGA

PACKAGE DESCRIPTION:  HBGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, HEAT SINK/SLUG

PART PACKAGE CODE:  BGA

PIN COUNT:  352

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.36 MM

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  3 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

WIDTH:  27 MM

UPS/UCS/PERIPHERAL ICS TYPE:  BUS CONTROLLER, PCI

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