OR3T30-6BA256
BGA, BGA256,20X20,50Call for availability
Manufactured by:
Mfr Part#: OR3T30-6BA256
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA256,20X20,50
PACKAGE EQUIVALENCE CODE: BGA256,20X20,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
JESD-30 CODE: S-PBGA-B256
MANUFACTURER: LATTICE SEMICONDUCTOR CORPORATION
MANUFACTURER PART NUMBER: OR3T30-6BA256
MOISTURE SENSITIVITY LEVEL: 1
NUMBER OF INPUTS: 217
NUMBER OF LOGIC CELLS: 1568
NUMBER OF OUTPUTS: 217
NUMBER OF TERMINALS: 256
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA256,20X20,50
PACKAGE EQUIVALENCE CODE: BGA256,20X20,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PBFREE CODE: NO
PEAK REFLOW TEMPERATURE (CEL): 225
POWER SUPPLIES: 3.3 V
PROGRAMMABLE LOGIC TYPE: FIELD PROGRAMMABLE GATE ARRAY
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: FIELD PROGRAMMABLE GATE ARRAYS
SUPPLY VOLTAGE-NOM: 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: BALL
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
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