88AP270MA2-BGO2C624
VFBGA, BGA356,24X24,20Call for availability
Mfr Part#: 88AP270MA2-BGO2C624
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: VFBGA
PACKAGE DESCRIPTION: VFBGA, BGA356,24X24,20
PACKAGE EQUIVALENCE CODE: BGA356,24X24,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, VERY THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDRESS BUS WIDTH: 26
BOUNDARY SCAN: YES
CLOCK FREQUENCY-MAX: 13 MHZ
EXTERNAL DATA BUS WIDTH: 32
FORMAT: FIXED POINT
INTEGRATED CACHE: NO
JESD-30 CODE: S-PBGA-B356
LENGTH: 13 MM
LOW POWER MODE: YES
MANUFACTURER: MARVELL
MANUFACTURER PART NUMBER: 88AP270MA2-BGO2C624
NUMBER OF TERMINALS: 356
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: VFBGA
PACKAGE DESCRIPTION: VFBGA, BGA356,24X24,20
PACKAGE EQUIVALENCE CODE: BGA356,24X24,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, VERY THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 356
POWER SUPPLIES: 1.8/3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1 MM
SPEED: 624 MHZ
SUBCATEGORY: GRAPHICS PROCESSORS
SUPPLY VOLTAGE-MAX: 1.705 V
SUPPLY VOLTAGE-MIN: 1.4725 V
SUPPLY VOLTAGE-NOM: 1.55 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TERMINAL FORM: BALL
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 13 MM
UPS/UCS/PERIPHERAL ICS TYPE: MICROPROCESSOR, RISC
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