88AP270MA2-BHE1C520
23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-360Call for availability
Mfr Part#: 88AP270MA2-BHE1C520
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-360
PACKAGE EQUIVALENCE CODE: BGA360,22X22,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDRESS BUS WIDTH: 26
BOUNDARY SCAN: YES
CLOCK FREQUENCY-MAX: 13 MHZ
EXTERNAL DATA BUS WIDTH: 32
FORMAT: FIXED POINT
INTEGRATED CACHE: NO
JESD-30 CODE: S-PBGA-B360
JESD-609 CODE: E1
LENGTH: 23 MM
LOW POWER MODE: YES
MANUFACTURER: MARVELL
MANUFACTURER PART NUMBER: 88AP270MA2-BHE1C520
NUMBER OF TERMINALS: 360
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-360
PACKAGE EQUIVALENCE CODE: BGA360,22X22,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 360
POWER SUPPLIES: 1.8/3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 2.59 MM
SPEED: 520 MHZ
SUBCATEGORY: GRAPHICS PROCESSORS
SUPPLY VOLTAGE-MAX: 1.705 V
SUPPLY VOLTAGE-MIN: 1.3775 V
SUPPLY VOLTAGE-NOM: 1.45 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TERMINAL FINISH: TIN SILVER COPPER
TERMINAL FORM: BALL
TERMINAL PITCH: 1 MM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 23 MM
UPS/UCS/PERIPHERAL ICS TYPE: MICROPROCESSOR, RISC
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