24LC04-I/P

24LC04-I/P

DIP, DIP8,.3

Call for availability

Manufactured by:

MICROCHIP TECHNOLOGY INC

Mfr Part#:  24LC04-I/P

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP8,.3

PACKAGE EQUIVALENCE CODE:  DIP8,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

DATA RETENTION TIME-MIN:  100

ENDURANCE:  100000 WRITE/ERASE CYCLES

I2C CONTROL BYTE:  1010DDMR

JESD-30 CODE:  R-PDIP-T8

JESD-609 CODE:  E0

MANUFACTURER:  MICROCHIP TECHNOLOGY INC

MANUFACTURER PART NUMBER:  24LC04-I/P

MEMORY DENSITY:  4.096 KBIT

MEMORY IC TYPE:  EEPROM

MEMORY WIDTH:  8

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  512 WORDS

NUMBER OF WORDS CODE:  512

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  512X8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP8,.3

PACKAGE EQUIVALENCE CODE:  DIP8,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PARALLEL/SERIAL:  SERIAL

POWER SUPPLIES:  3/5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SERIAL BUS TYPE:  I2C

STANDBY CURRENT-MAX:  30 ΜA

SUBCATEGORY:  EEPROMS

SUPPLY CURRENT-MAX:  3 ΜA

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

WRITE PROTECTION:  HARDWARE

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