EQCO62T20.3-TRAY
HVQCCNCall for availability
Manufactured by:
Mfr Part#: EQCO62T20.3-TRAY
PACKAGE BODY MATERIAL: UNSPECIFIED
PACKAGE CODE: HVQCCN
PACKAGE DESCRIPTION: HVQCCN,
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
JESD-30 CODE: S-XQCC-N16
JESD-609 CODE: E4
LENGTH: 4 MM
MANUFACTURER: MICROCHIP TECHNOLOGY INC
MANUFACTURER PART NUMBER: EQCO62T20.3-TRAY
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 16
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: UNSPECIFIED
PACKAGE CODE: HVQCCN
PACKAGE DESCRIPTION: HVQCCN,
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
SEATED HEIGHT-MAX: 1 MM
SUPPLY VOLTAGE-NOM: 1.2 V
SURFACE MOUNT: YES
TELECOM IC TYPE: TELECOM CIRCUIT
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: NICKEL/PALLADIUM/GOLD (NI/PD/AU)
TERMINAL FORM: NO LEAD
TERMINAL PITCH: 650 ΜM
TERMINAL POSITION: QUAD
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 4 MM
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