LAN89218AQ-B

LAN89218AQ-B

LFQFP

Call for availability

Manufactured by:

MICROCHIP TECHNOLOGY INC

Mfr Part#:  LAN89218AQ-B

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  7

BOUNDARY SCAN:  NO

COMMUNICATION PROTOCOL:  ETHERNET

DATA ENCODING/DECODING METHOD:  NRZ; BIPH-LEVEL(MANCHESTER)

DATA TRANSFER RATE-MAX:  12.5 MBPS

EXTERNAL DATA BUS WIDTH:  32

JESD-30 CODE:  S-PQFP-G100

JESD-609 CODE:  E3

LENGTH:  14 MM

LOW POWER MODE:  YES

MANUFACTURER:  MICROCHIP TECHNOLOGY INC

MANUFACTURER PART NUMBER:  LAN89218AQ-B

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF SERIAL I/OS:  2

NUMBER OF TERMINALS:  100

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

PEAK REFLOW TEMPERATURE (CEL):  260

SCREENING LEVEL:  AEC-Q100; ISO/TS-16949

SEATED HEIGHT-MAX:  1.6 MM

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  3 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  14 MM

UPS/UCS/PERIPHERAL ICS TYPE:  SERIAL IO/COMMUNICATION CONTROLLER, LAN

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