MCP23S09-E/MG
Call for availability
Manufactured by:
Mfr Part#: MCP23S09-E/MG
PACKAGE / CASE: 16-VFQFN EXPOSED PAD
PACKAGING: TUBE
STANDARD PACKAGE: 120
SUPPLIER DEVICE PACKAGE: 16-QFN-EP (3X3)
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
CATEGORY: INTEGRATED CIRCUITS (ICS)
CURRENT - OUTPUT SOURCE/SINK: 25MA
FAMILY: INTERFACE - I/O EXPANDERS
FREQUENCY - CLOCK: 10MHZ
INTERFACE: SPI
INTERRUPT OUTPUT: YES
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: MICROCHIP TECHNOLOGY
MANUFACTURER PART NUMBER: MCP23S09-E/MG
MANUFACTURER STANDARD LEAD TIME: 5 WEEKS
MOISTURE SENSITIVITY LEVEL (MSL): 1 (UNLIMITED)
MOUNTING TYPE: SURFACE MOUNT
NUMBER OF I/O: 8
OPERATING TEMPERATURE: -40°C ~ 125°C
OUTPUT TYPE: OPEN DRAIN
PACKAGE / CASE: 16-VFQFN EXPOSED PAD
PACKAGING: TUBE
STANDARD PACKAGE: 120
SUPPLIER DEVICE PACKAGE: 16-QFN-EP (3X3)
VOLTAGE - SUPPLY: 1.8 V ~ 5.5 V
ALTERNATE PARTS: MCP23S09T-E/MG
Related Products
MFR. Name: Maxim Integrated Products
MFR. Name: AMD
MFR. Name: AMD
MFR. Name: Conexant Systems
MFR. Name: Cypress Semiconductor
Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .