MCP25625-E/ML

MCP25625-E/ML

HVQCCN

Call for availability

Manufactured by:

MICROCHIP TECHNOLOGY INC

Mfr Part#:  MCP25625-E/ML

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVQCCN

PACKAGE DESCRIPTION:  HVQCCN,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  S-PQCC-N28

JESD-609 CODE:  E3

LENGTH:  6 MM

MANUFACTURER:  MICROCHIP TECHNOLOGY INC

MANUFACTURER PART NUMBER:  MCP25625-E/ML

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  28

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVQCCN

PACKAGE DESCRIPTION:  HVQCCN,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

PEAK REFLOW TEMPERATURE (CEL):  260

SCREENING LEVEL:  ISO/TS-16949

SEATED HEIGHT-MAX:  1 MM

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TELECOM IC TYPE:  INTERFACE CIRCUIT

TEMPERATURE GRADE:  AUTOMOTIVE

TERMINAL FINISH:  MATTE TIN

TERMINAL FORM:  NO LEAD

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  6 MM

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