MIC2788-XYMT
HVSON, SOLCC8,.08,20Call for availability
Mfr Part#: MIC2788-XYMT
MANUFACTURER PACKAGE CODE: MLF
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: HVSON
PACKAGE DESCRIPTION: HVSON, SOLCC8,.08,20
PACKAGE EQUIVALENCE CODE: SOLCC8,.08,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
PART PACKAGE CODE: DFN
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADJUSTABLE THRESHOLD: NO
ANALOG IC - OTHER TYPE: POWER SUPPLY SUPPORT CIRCUIT
JESD-30 CODE: S-PDSO-N8
JESD-609 CODE: E4
LENGTH: 2 MM
MANUFACTURER: MICROCHIP TECHNOLOGY INC
MANUFACTURER PACKAGE CODE: MLF
MANUFACTURER PART NUMBER: MIC2788-XYMT
NUMBER OF CHANNELS: 1
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 8
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: HVSON
PACKAGE DESCRIPTION: HVSON, SOLCC8,.08,20
PACKAGE EQUIVALENCE CODE: SOLCC8,.08,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
PART PACKAGE CODE: DFN
PIN COUNT: 8
POWER SUPPLIES: 3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 600 ΜM
SUBCATEGORY: POWER MANAGEMENT CIRCUITS
SUPPLY CURRENT-MAX (ISUP): 7.5 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 5.5 V
SUPPLY VOLTAGE-MIN (VSUP): 1.6 V
SUPPLY VOLTAGE-NOM (VSUP): 3 V
SURFACE MOUNT: YES
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: NICKEL PALLADIUM GOLD
TERMINAL FORM: NO LEAD
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: DUAL
WIDTH: 2 MM
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