A500K130-BG272
BGA, BGA272,20X20,50Call for availability
Manufactured by:
Mfr Part#: A500K130-BG272
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA272,20X20,50
PACKAGE EQUIVALENCE CODE: BGA272,20X20,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
JESD-30 CODE: S-PBGA-B272
MANUFACTURER: MICROSEMI CORPORATION
MANUFACTURER PART NUMBER: A500K130-BG272
NUMBER OF INPUTS: 204
NUMBER OF LOGIC CELLS: 12800
NUMBER OF OUTPUTS: 204
NUMBER OF TERMINALS: 272
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA272,20X20,50
PACKAGE EQUIVALENCE CODE: BGA272,20X20,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
POWER SUPPLIES: 2.5,2.5/3.3 V
PROGRAMMABLE LOGIC TYPE: FIELD PROGRAMMABLE GATE ARRAY
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: FIELD PROGRAMMABLE GATE ARRAYS
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: BALL
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: BOTTOM
Related Products
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .