MT8870BC

MT8870BC

DIP, DIP18,.3

Call for availability

Manufactured by:

MICROSEMI

Mfr Part#:  MT8870BC

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP18,.3

PACKAGE EQUIVALENCE CODE:  DIP18,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-XDIP-T18

MANUFACTURER:  MICROSEMI CORPORATION

MANUFACTURER PART NUMBER:  MT8870BC

NUMBER OF TERMINALS:  18

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP18,.3

PACKAGE EQUIVALENCE CODE:  DIP18,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

PIN COUNT:  18

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  TELECOM SIGNALING CIRCUITS

SUPPLY CURRENT-MAX:  9 MA

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TELECOM IC TYPE:  DTMF SIGNALING CIRCUIT

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

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