MT8870DS

MT8870DS

SOP, SOP18,.4

Call for availability

Manufactured by:

MICROSEMI

Mfr Part#:  MT8870DS

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP18,.4

PACKAGE EQUIVALENCE CODE:  SOP18,.4

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-PDSO-G18

JESD-609 CODE:  E0

MANUFACTURER:  MICROSEMI CORPORATION

MANUFACTURER PART NUMBER:  MT8870DS

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  18

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP18,.4

PACKAGE EQUIVALENCE CODE:  SOP18,.4

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PART PACKAGE CODE:  SOIC

PBFREE CODE:  NO

PIN COUNT:  18

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  TELECOM SIGNALING CIRCUITS

SUPPLY CURRENT-MAX:  9 MA

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TELECOM IC TYPE:  DTMF SIGNALING CIRCUIT

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

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