MT88L70AN1
SSOP, SSOP20,.3Call for availability
Mfr Part#: MT88L70AN1
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: SSOP
PACKAGE DESCRIPTION: SSOP, SSOP20,.3
PACKAGE EQUIVALENCE CODE: SSOP20,.3
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, SHRINK PITCH
PART PACKAGE CODE: SSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
JESD-30 CODE: R-PDSO-G20
JESD-609 CODE: E3
LENGTH: 7.2 MM
MANUFACTURER: MICROSEMI CORPORATION
MANUFACTURER PART NUMBER: MT88L70AN1
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 20
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: SSOP
PACKAGE DESCRIPTION: SSOP, SSOP20,.3
PACKAGE EQUIVALENCE CODE: SSOP20,.3
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, SHRINK PITCH
PART PACKAGE CODE: SSOP
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 20
POWER SUPPLIES: 3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 2 MM
SUBCATEGORY: TELECOM SIGNALING CIRCUITS
SUPPLY CURRENT-MAX: 5.5 MA
SUPPLY VOLTAGE-NOM: 3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TELECOM IC TYPE: DTMF SIGNALING CIRCUIT
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: MATTE TIN
TERMINAL FORM: GULL WING
TERMINAL PITCH: 650 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 5.3 MM
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