PM73124-PI
BGA, BGA324,22X22,40Call for availability
Manufactured by:
Mfr Part#: PM73124-PI
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA324,22X22,40
PACKAGE EQUIVALENCE CODE: BGA324,22X22,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
JESD-30 CODE: S-PBGA-B324
JESD-609 CODE: E0
MANUFACTURER: MICROSEMI STORAGE OTN AND NETWORKING SOLUTIONS
MANUFACTURER PART NUMBER: PM73124-PI
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF TERMINALS: 324
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA324,22X22,40
PACKAGE EQUIVALENCE CODE: BGA324,22X22,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
POWER SUPPLIES: 2.5,3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: ATM/SONET/SDH ICS
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TELECOM IC TYPE: ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: BALL
TERMINAL PITCH: 1 MM
TERMINAL POSITION: BOTTOM
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