PM7346-BI
BGA, BGA256,20X20,50Call for availability
Manufactured by:
Mfr Part#: PM7346-BI
PACKAGE BODY MATERIAL: CERAMIC
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA256,20X20,50
PACKAGE EQUIVALENCE CODE: BGA256,20X20,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
JESD-30 CODE: S-XBGA-B256
MANUFACTURER: MICROSEMI STORAGE OTN AND NETWORKING SOLUTIONS
MANUFACTURER PART NUMBER: PM7346-BI
NUMBER OF TERMINALS: 256
PACKAGE BODY MATERIAL: CERAMIC
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA256,20X20,50
PACKAGE EQUIVALENCE CODE: BGA256,20X20,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
POWER SUPPLIES: 3.3,5 V
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: ATM/SONET/SDH ICS
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TERMINAL FORM: BALL
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: BOTTOM
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