SC11362CN

SC11362CN

DIP, DIP24,.6

Call for availability

Manufactured by:

MICROSEMI

Mfr Part#:  SC11362CN

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP24,.6

PACKAGE EQUIVALENCE CODE:  DIP24,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

COMPANDING LAW:  A/MU-LAW

FILTER:  NO

JESD-30 CODE:  R-PDIP-T24

JESD-609 CODE:  E0

LINEAR CODING:  16-BIT

MANUFACTURER:  MICROSEMI STORAGE OTN AND NETWORKING SOLUTIONS

MANUFACTURER PART NUMBER:  SC11362CN

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  24

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP24,.6

PACKAGE EQUIVALENCE CODE:  DIP24,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  24

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  CODECS

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  NO

TELECOM IC TYPE:  ADPCM CODEC

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

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