WEDPN4M64V-100BI

WEDPN4M64V-100BI

BGA

Call for availability

Manufactured by:

MICROSEMI

Mfr Part#:  WEDPN4M64V-100BI

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS MODE:  FOUR BANK PAGE BURST

ACCESS TIME-MAX:  7 NS

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

ALTERNATE MEMORY WIDTH:  32

JESD-30 CODE:  S-PBGA-B219

MANUFACTURER:  MICROSEMI CORPORATION

MANUFACTURER PART NUMBER:  WEDPN4M64V-100BI

MEMORY DENSITY:  268.4355 MBIT

MEMORY IC TYPE:  SYNCHRONOUS DRAM

MEMORY WIDTH:  64

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  219

NUMBER OF WORDS:  4.1943 M

NUMBER OF WORDS CODE:  4000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  4MX64

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  219

QUALIFICATION STATUS:  NOT QUALIFIED

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

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