WS1M32-25G3I

WS1M32-25G3I

Call for availability

Manufactured by:

MICROSEMI

Mfr Part#:  WS1M32-25G3I

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE DESCRIPTION:  ,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  MICROELECTRONIC ASSEMBLY

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  25 NS

ADDITIONAL FEATURE:  CAN ALSO BE CONFIGURED AS 1M X 32 AND 2M X 16

JESD-30 CODE:  S-CQMA-G84

MANUFACTURER:  MICROSEMI CORPORATION

MANUFACTURER PART NUMBER:  WS1M32-25G3I

MEMORY DENSITY:  33.5544 MBIT

MEMORY IC TYPE:  SRAM MODULE

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  84

NUMBER OF WORDS:  4.1943 M

NUMBER OF WORDS CODE:  4000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  4MX8

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE DESCRIPTION:  ,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  MICROELECTRONIC ASSEMBLY

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  QFP

PBFREE CODE:  NO

PIN COUNT:  84

QUALIFICATION STATUS:  NOT QUALIFIED

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  GULL WING

TERMINAL POSITION:  QUAD

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