ZL30406QGC

ZL30406QGC

HTFQFP, TQFP64,.47SQ

Call for availability

Manufactured by:

MICROSEMI

Mfr Part#:  ZL30406QGC

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HTFQFP

PACKAGE DESCRIPTION:  HTFQFP, TQFP64,.47SQ

PACKAGE EQUIVALENCE CODE:  TQFP64,.47SQ

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  S-PQFP-G64

JESD-609 CODE:  E0

LENGTH:  10 MM

MANUFACTURER:  MICROSEMI CORPORATION

MANUFACTURER PART NUMBER:  ZL30406QGC

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  64

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HTFQFP

PACKAGE DESCRIPTION:  HTFQFP, TQFP64,.47SQ

PACKAGE EQUIVALENCE CODE:  TQFP64,.47SQ

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  240

PIN COUNT:  64

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUBCATEGORY:  OTHER TELECOM ICS

SUPPLY CURRENT-MAX:  155 MA

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TELECOM IC TYPE:  SUPPORT CIRCUIT

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  10 MM

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