M5M27C256AK-12
WDIP, DIP28,.6Call for availability
Mfr Part#: M5M27C256AK-12
PACKAGE BODY MATERIAL: CERAMIC, GLASS-SEALED
PACKAGE CODE: WDIP
PACKAGE DESCRIPTION: WDIP, DIP28,.6
PACKAGE EQUIVALENCE CODE: DIP28,.6
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: IN-LINE, WINDOW
PART PACKAGE CODE: DIP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 120 NS
I/O TYPE: COMMON
JESD-30 CODE: R-GDIP-T28
JESD-609 CODE: E0
LENGTH: 36.7 MM
MANUFACTURER: MITSUBISHI ELECTRIC
MANUFACTURER PART NUMBER: M5M27C256AK-12
MEMORY DENSITY: 262.144 KBIT
MEMORY IC TYPE: UVPROM
MEMORY WIDTH: 8
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 28
NUMBER OF WORDS: 32.768 K
NUMBER OF WORDS CODE: 32000
OPERATING MODE: ASYNCHRONOUS
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 32KX8
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: CERAMIC, GLASS-SEALED
PACKAGE CODE: WDIP
PACKAGE DESCRIPTION: WDIP, DIP28,.6
PACKAGE EQUIVALENCE CODE: DIP28,.6
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: IN-LINE, WINDOW
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: DIP
PBFREE CODE: NO
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 28
POWER SUPPLIES: 5 V
PROGRAMMING VOLTAGE: 12.5 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 5.1 MM
STANDBY CURRENT-MAX: 100 ΜA
SUBCATEGORY: EPROMS
SUPPLY CURRENT-MAX: 30 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 5.5 V
SUPPLY VOLTAGE-MIN (VSUP): 4.5 V
SUPPLY VOLTAGE-NOM (VSUP): 5 V
SURFACE MOUNT: NO
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: THROUGH-HOLE
TERMINAL PITCH: 2.54 MM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 15.24 MM
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