10H531/BFAJC

10H531/BFAJC

DFP, FL16,.3

Call for availability

Manufactured by:

MOTOROLA

Mfr Part#:  10H531/BFAJC

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DFP

PACKAGE DESCRIPTION:  DFP, FL16,.3

PACKAGE EQUIVALENCE CODE:  FL16,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-XDFP-F16

JESD-609 CODE:  E0

LOGIC IC TYPE:  D FLIP-FLOP

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  10H531/BFAJC

MAX FREQUENCY@NOM-SUP:  250 MHZ

NUMBER OF FUNCTIONS:  2

NUMBER OF TERMINALS:  16

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DFP

PACKAGE DESCRIPTION:  DFP, FL16,.3

PACKAGE EQUIVALENCE CODE:  FL16,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK

POWER SUPPLY CURRENT-MAX (ICC):  62 MA

QUALIFICATION STATUS:  NOT QUALIFIED

SCREENING LEVEL:  38535Q/M;38534H;883B

SUBCATEGORY:  FF/LATCHES

SURFACE MOUNT:  YES

TECHNOLOGY:  ECL

TEMPERATURE GRADE:  MILITARY

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  FLAT

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TRIGGER TYPE:  MASTER-SLAVE

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