DSP56002PV66
LFQFP, QFP144,.87SQ,20Call for availability
Mfr Part#: DSP56002PV66
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFQFP
PACKAGE DESCRIPTION: LFQFP, QFP144,.87SQ,20
PACKAGE EQUIVALENCE CODE: QFP144,.87SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE, FINE PITCH
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDRESS BUS WIDTH: 16
BARREL SHIFTER: NO
BIT SIZE: 24
BOUNDARY SCAN: NO
CLOCK FREQUENCY-MAX: 66 MHZ
EXTERNAL DATA BUS WIDTH: 24
FORMAT: FIXED POINT
INTEGRATED CACHE: NO
INTERNAL BUS ARCHITECTURE: MULTIPLE
JESD-30 CODE: S-PQFP-G144
JESD-609 CODE: E0
LENGTH: 20 MM
LOW POWER MODE: NO
MANUFACTURER: MOTOROLA SEMICONDUCTOR PRODUCTS
MANUFACTURER PART NUMBER: DSP56002PV66
NUMBER OF DMA CHANNELS: 0
NUMBER OF EXTERNAL INTERRUPTS: 3
NUMBER OF SERIAL I/OS: 2
NUMBER OF TERMINALS: 144
NUMBER OF TIMERS: 1
ON CHIP DATA RAM WIDTH: 24
ON CHIP PROGRAM ROM WIDTH: 0
OPERATING TEMPERATURE-MAX: 105 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFQFP
PACKAGE DESCRIPTION: LFQFP, QFP144,.87SQ,20
PACKAGE EQUIVALENCE CODE: QFP144,.87SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE, FINE PITCH
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
POWER SUPPLIES: 5 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (WORDS): 512
SEATED HEIGHT-MAX: 1.6 MM
SUBCATEGORY: DIGITAL SIGNAL PROCESSORS
SUPPLY CURRENT-MAX: 130 MA
SUPPLY VOLTAGE-MAX: 5.5 V
SUPPLY VOLTAGE-MIN: 4.5 V
SUPPLY VOLTAGE-NOM: 5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: QUAD
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 20 MM
UPS/UCS/PERIPHERAL ICS TYPE: DIGITAL SIGNAL PROCESSOR, OTHER
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