DSP56002PV66

DSP56002PV66

LFQFP, QFP144,.87SQ,20

Call for availability

Manufactured by:

MOTOROLA

Mfr Part#:  DSP56002PV66

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP, QFP144,.87SQ,20

PACKAGE EQUIVALENCE CODE:  QFP144,.87SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  16

BARREL SHIFTER:  NO

BIT SIZE:  24

BOUNDARY SCAN:  NO

CLOCK FREQUENCY-MAX:  66 MHZ

EXTERNAL DATA BUS WIDTH:  24

FORMAT:  FIXED POINT

INTEGRATED CACHE:  NO

INTERNAL BUS ARCHITECTURE:  MULTIPLE

JESD-30 CODE:  S-PQFP-G144

JESD-609 CODE:  E0

LENGTH:  20 MM

LOW POWER MODE:  NO

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  DSP56002PV66

NUMBER OF DMA CHANNELS:  0

NUMBER OF EXTERNAL INTERRUPTS:  3

NUMBER OF SERIAL I/OS:  2

NUMBER OF TERMINALS:  144

NUMBER OF TIMERS:  1

ON CHIP DATA RAM WIDTH:  24

ON CHIP PROGRAM ROM WIDTH:  0

OPERATING TEMPERATURE-MAX:  105 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP, QFP144,.87SQ,20

PACKAGE EQUIVALENCE CODE:  QFP144,.87SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (WORDS):  512

SEATED HEIGHT-MAX:  1.6 MM

SUBCATEGORY:  DIGITAL SIGNAL PROCESSORS

SUPPLY CURRENT-MAX:  130 MA

SUPPLY VOLTAGE-MAX:  5.5 V

SUPPLY VOLTAGE-MIN:  4.5 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  20 MM

UPS/UCS/PERIPHERAL ICS TYPE:  DIGITAL SIGNAL PROCESSOR, OTHER

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