MC10H158LDS

MC10H158LDS

DIP, DIP16,.3

Call for availability

Manufactured by:

MOTOROLA

Mfr Part#:  MC10H158LDS

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP16,.3

PACKAGE EQUIVALENCE CODE:  DIP16,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-XDIP-T16

JESD-609 CODE:  E0

LOGIC IC TYPE:  MULTIPLEXER

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MC10H158LDS

NUMBER OF FUNCTIONS:  4

NUMBER OF INPUTS:  2

NUMBER OF TERMINALS:  16

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP16,.3

PACKAGE EQUIVALENCE CODE:  DIP16,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

SUBCATEGORY:  MULTIPLEXER/DEMULTIPLEXERS

SURFACE MOUNT:  NO

TECHNOLOGY:  ECL

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

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