MC14076BCL

MC14076BCL

DIP, DIP16,.3

Call for availability

Manufactured by:

MOTOROLA

Mfr Part#:  MC14076BCL

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP16,.3

PACKAGE EQUIVALENCE CODE:  DIP16,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  WITH HOLD MODE; WITH DUAL OUTPUT ENABLE

FAMILY:  4000/14000/40000

JESD-30 CODE:  R-GDIP-T16

JESD-609 CODE:  E0

LENGTH:  19.495 MM

LOAD CAPACITANCE (CL):  50 PF

LOGIC IC TYPE:  D FLIP-FLOP

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MC14076BCL

MAX FREQUENCY@NOM-SUP:  1.8 MHZ

MAX I(OL):  4.2 MA

NUMBER OF BITS:  4

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  16

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

OUTPUT CHARACTERISTICS:  3-STATE

OUTPUT POLARITY:  TRUE

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP16,.3

PACKAGE EQUIVALENCE CODE:  DIP16,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

POWER SUPPLIES:  5/15 V

PROPAGATION DELAY (TPD):  600 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  5.08 MM

SUBCATEGORY:  FF/LATCHES

SUPPLY VOLTAGE-MAX (VSUP):  18 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  MILITARY

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

TRIGGER TYPE:  POSITIVE EDGE

WIDTH:  7.62 MM

FMAX-MIN:  1.8 MHZ

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