ADDITIONAL FEATURE:  3 PIPELINED PROCESSORS; 10K X 8 INTERNAL ROM; 2K X 8 EEPROM

ADDRESS BUS WIDTH:  16

BOUNDARY SCAN:  NO

CLOCK FREQUENCY-MAX:  10 MHZ

DATA ENCODING/DECODING METHOD:  BIPH-SPACE(FM0)

DATA TRANSFER RATE-MAX:  0.15625 MBPS

EXTERNAL DATA BUS WIDTH:  8

JESD-30 CODE:  R-PDSO-G32

JESD-609 CODE:  E0

LENGTH:  20.96 MM

LOW POWER MODE:  YES

MANUFACTURER:  MOTOROLA MOBILITY LLC

MANUFACTURER PART NUMBER:  MC143120E2DW

NUMBER OF DMA CHANNELS:  0

NUMBER OF I/O LINES:  11

NUMBER OF SERIAL I/OS:  1

NUMBER OF TERMINALS:  32

ON CHIP DATA RAM WIDTH:  8

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PART PACKAGE CODE:  SOIC

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  32

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (WORDS):  2000

SEATED HEIGHT-MAX:  2.54 MM

SUPPLY VOLTAGE-MAX:  5.5 V

SUPPLY VOLTAGE-MIN:  4.5 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  MOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  10.92 MM

UPS/UCS/PERIPHERAL ICS TYPE:  SERIAL IO/COMMUNICATION CONTROLLER, LAN