MC68606FN16B

MC68606FN16B

QCCJ, LDCC84,1.2SQ

Call for availability

Manufactured by:

MOTOROLA

Mfr Part#:  MC68606FN16B

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QCCJ

PACKAGE DESCRIPTION:  QCCJ, LDCC84,1.2SQ

PACKAGE EQUIVALENCE CODE:  LDCC84,1.2SQ

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  CHIP CARRIER

PART PACKAGE CODE:  LCC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  24

BOUNDARY SCAN:  NO

BUS COMPATIBILITY:  M68000; IAPX 86

CLOCK FREQUENCY-MAX:  16.67 MHZ

COMMUNICATION PROTOCOL:  SYNC, HDLC; LAPD

DATA ENCODING/DECODING METHOD:  NRZ

DATA TRANSFER RATE-MAX:  0.256 MBPS

EXTERNAL DATA BUS WIDTH:  16

JESD-30 CODE:  S-PQCC-J84

JESD-609 CODE:  E0

LENGTH:  29.285 MM

LOW POWER MODE:  NO

MANUFACTURER:  MOTOROLA MOBILITY LLC

MANUFACTURER PART NUMBER:  MC68606FN16B

NUMBER OF DMA CHANNELS:  1

NUMBER OF I/O LINES:  0

NUMBER OF SERIAL I/OS:  1

NUMBER OF TERMINALS:  84

ON CHIP DATA RAM WIDTH:  0

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QCCJ

PACKAGE DESCRIPTION:  QCCJ, LDCC84,1.2SQ

PACKAGE EQUIVALENCE CODE:  LDCC84,1.2SQ

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  CHIP CARRIER

PART PACKAGE CODE:  LCC

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  84

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (WORDS):  0

SEATED HEIGHT-MAX:  4.57 MM

SUBCATEGORY:  SERIAL IO/COMMUNICATION CONTROLLERS

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  J BEND

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  29.285 MM

UPS/UCS/PERIPHERAL ICS TYPE:  SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL

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