ADDRESS BUS WIDTH:  2

BOUNDARY SCAN:  NO

BUS COMPATIBILITY:  6800

CLOCK FREQUENCY-MAX:  2 MHZ

COMMUNICATION PROTOCOL:  SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; ADCCP

DATA ENCODING/DECODING METHOD:  NRZ; NRZI

EXTERNAL DATA BUS WIDTH:  8

JESD-30 CODE:  R-PDIP-T28

JESD-609 CODE:  E0

LENGTH:  36.83 MM

LOW POWER MODE:  NO

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MC68B54P

NUMBER OF DMA CHANNELS:  0

NUMBER OF I/O LINES:  0

NUMBER OF SERIAL I/OS:  1

NUMBER OF TERMINALS:  28

ON CHIP DATA RAM WIDTH:  0

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP28,.6

PACKAGE EQUIVALENCE CODE:  DIP28,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (WORDS):  0

SEATED HEIGHT-MAX:  5.08 MM

SUBCATEGORY:  SERIAL IO/COMMUNICATION CONTROLLERS

SUPPLY VOLTAGE-MAX:  5.25 V

SUPPLY VOLTAGE-MIN:  4.75 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  MOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  15.24 MM

UPS/UCS/PERIPHERAL ICS TYPE:  SERIAL IO/COMMUNICATION CONTROLLER, SERIAL