MC68EC030FE25B

MC68EC030FE25B

QFP, QFP(UNSPEC)

Call for availability

Manufactured by:

MOTOROLA

Mfr Part#:  MC68EC030FE25B

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP(UNSPEC)

PACKAGE EQUIVALENCE CODE:  QFP(UNSPEC)

PACKAGE STYLE:  FLATPACK

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

BIT SIZE:  32

JESD-609 CODE:  E0

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MC68EC030FE25B

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP(UNSPEC)

PACKAGE EQUIVALENCE CODE:  QFP(UNSPEC)

PACKAGE STYLE:  FLATPACK

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SPEED:  25 MHZ

SUBCATEGORY:  MICROPROCESSORS

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL POSITION:  QUAD

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC

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