MC9S08RE16FJ
LQFP-32Call for availability
Manufactured by:
Mfr Part#: MC9S08RE16FJ
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QFP
PACKAGE DESCRIPTION: LQFP-32
PACKAGE EQUIVALENCE CODE: QFP32,.35SQ,32
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
BIT SIZE: 8
JESD-30 CODE: S-PQFP-G32
MANUFACTURER: MOTOROLA SEMICONDUCTOR PRODUCTS
MANUFACTURER PART NUMBER: MC9S08RE16FJ
NUMBER OF TERMINALS: 32
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QFP
PACKAGE DESCRIPTION: LQFP-32
PACKAGE EQUIVALENCE CODE: QFP32,.35SQ,32
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK
POWER SUPPLIES: 1.8/3.6 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (BYTES): 1024
ROM (WORDS): 16384
ROM PROGRAMMABILITY: FLASH
SPEED: 16 MHZ
SUBCATEGORY: MICROCONTROLLERS
SUPPLY CURRENT-MAX: 4.8 MA
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: GULL WING
TERMINAL PITCH: 800 ΜM
TERMINAL POSITION: QUAD
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