MCM56824AFN25R2

MCM56824AFN25R2

QCCJ

Call for availability

Manufactured by:

MOTOROLA

Mfr Part#:  MCM56824AFN25R2

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QCCJ

PACKAGE DESCRIPTION:  QCCJ,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  CHIP CARRIER

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  25 NS

ADDITIONAL FEATURE:  ON-CHIP ADDRESS MULTIPLEXER; DSPRAM

JESD-30 CODE:  S-PQCC-J52

LENGTH:  19.1262 MM

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MCM56824AFN25R2

MEMORY DENSITY:  196.608 KBIT

MEMORY IC TYPE:  APPLICATION SPECIFIC SRAM

MEMORY WIDTH:  24

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  52

NUMBER OF WORDS:  8.192 K

NUMBER OF WORDS CODE:  8000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  8KX24

OUTPUT CHARACTERISTICS:  3-STATE

OUTPUT ENABLE:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QCCJ

PACKAGE DESCRIPTION:  QCCJ,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  CHIP CARRIER

PARALLEL/SERIAL:  PARALLEL

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  4.57 MM

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  J BEND

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  QUAD

WIDTH:  19.1262 MM

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