ACCESS TIME-MAX:  2.5 NS

ADDITIONAL FEATURE:  BYTE WRITE CONTROL; BOUNDARY SCAN

I/O TYPE:  COMMON

JESD-30 CODE:  R-PBGA-B119

JESD-609 CODE:  E0

LENGTH:  22 MM

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MCM69R536ZP5

MEMORY DENSITY:  1.1796 MBIT

MEMORY IC TYPE:  LATE-WRITE SRAM

MEMORY WIDTH:  36

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  119

NUMBER OF WORDS:  32.768 K

NUMBER OF WORDS CODE:  32000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  32KX36

OUTPUT CHARACTERISTICS:  3-STATE

OUTPUT ENABLE:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA119,7X17,50

PACKAGE EQUIVALENCE CODE:  BGA119,7X17,50

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY

PARALLEL/SERIAL:  PARALLEL

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

POWER SUPPLIES:  1.5,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.4 MM

STANDBY VOLTAGE-MIN:  3.15 V

SUBCATEGORY:  SRAMS

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  3.15 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  BICMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  14 MM