MPC8265AZUPJDB
BGA, BGA480,29X29,50Call for availability
Manufactured by:
Mfr Part#: MPC8265AZUPJDB
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA480,29X29,50
PACKAGE EQUIVALENCE CODE: BGA480,29X29,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
BIT SIZE: 32
JESD-30 CODE: S-PBGA-B480
MANUFACTURER: MOTOROLA SEMICONDUCTOR PRODUCTS
MANUFACTURER PART NUMBER: MPC8265AZUPJDB
NUMBER OF TERMINALS: 480
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA480,29X29,50
PACKAGE EQUIVALENCE CODE: BGA480,29X29,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
POWER SUPPLIES: 2,3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SPEED: 300 MHZ
SUBCATEGORY: MICROPROCESSORS
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: BALL
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: BOTTOM
UPS/UCS/PERIPHERAL ICS TYPE: MICROPROCESSOR, RISC
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