MPC8270ZQMIB

MPC8270ZQMIB

BGA, BGA516,26X26,40

Call for availability

Manufactured by:

MOTOROLA

Mfr Part#:  MPC8270ZQMIB

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA516,26X26,40

PACKAGE EQUIVALENCE CODE:  BGA516,26X26,40

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  S-PBGA-B516

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MPC8270ZQMIB

NUMBER OF TERMINALS:  516

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA516,26X26,40

PACKAGE EQUIVALENCE CODE:  BGA516,26X26,40

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

POWER SUPPLIES:  1.5,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  OTHER UPS/UCS/PERIPHERAL ICS

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

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