XPC8260AZUKHBA
LBGA, BGA480,29X29,50Call for availability
Mfr Part#: XPC8260AZUKHBA
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LBGA
PACKAGE DESCRIPTION: LBGA, BGA480,29X29,50
PACKAGE EQUIVALENCE CODE: BGA480,29X29,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, LOW PROFILE
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDRESS BUS WIDTH: 32
BIT SIZE: 32
BOUNDARY SCAN: YES
CLOCK FREQUENCY-MAX: 66.66 MHZ
EXTERNAL DATA BUS WIDTH: 64
FORMAT: FLOATING POINT
INTEGRATED CACHE: YES
JESD-30 CODE: S-PBGA-B480
JESD-609 CODE: E0
LENGTH: 37.5 MM
LOW POWER MODE: NO
MANUFACTURER: MOTOROLA MOBILITY LLC
MANUFACTURER PART NUMBER: XPC8260AZUKHBA
NUMBER OF TERMINALS: 480
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LBGA
PACKAGE DESCRIPTION: LBGA, BGA480,29X29,50
PACKAGE EQUIVALENCE CODE: BGA480,29X29,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, LOW PROFILE
PART PACKAGE CODE: BGA
PIN COUNT: 480
POWER SUPPLIES: 2.5,3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.65 MM
SPEED: 233 MHZ
SUBCATEGORY: MICROPROCESSORS
SUPPLY VOLTAGE-MAX: 2.7 V
SUPPLY VOLTAGE-MIN: 2.4 V
SUPPLY VOLTAGE-NOM: 2.5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: BALL
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: BOTTOM
WIDTH: 37.5 MM
UPS/UCS/PERIPHERAL ICS TYPE: MICROPROCESSOR, RISC
Related Products
Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .