XPC860DCZP50C1

XPC860DCZP50C1

BGA

Call for availability

Manufactured by:

MOTOROLA

Mfr Part#:  XPC860DCZP50C1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  32

BIT SIZE:  32

CLOCK FREQUENCY-MAX:  50 MHZ

EXTERNAL DATA BUS WIDTH:  32

JESD-30 CODE:  S-PBGA-B357

JESD-609 CODE:  E0

LENGTH:  25 MM

MANUFACTURER:  MOTOROLA MOBILITY LLC

MANUFACTURER PART NUMBER:  XPC860DCZP50C1

NUMBER OF TERMINALS:  357

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  357

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.05 MM

SPEED:  50 MHZ

SUPPLY VOLTAGE-MAX:  3.465 V

SUPPLY VOLTAGE-MIN:  3.135 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  25 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC

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