ADDRESS BUS WIDTH: 32
BIT SIZE: 32
CLOCK FREQUENCY-MAX: 50 MHZ
EXTERNAL DATA BUS WIDTH: 32
JESD-30 CODE: S-PBGA-B357
JESD-609 CODE: E0
LENGTH: 25 MM
MANUFACTURER: MOTOROLA MOBILITY LLC
MANUFACTURER PART NUMBER: XPC860DECZP50C1
NUMBER OF TERMINALS: 357
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA,
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 357
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 2.05 MM
SPEED: 50 MHZ
SUPPLY VOLTAGE-MAX: 3.465 V
SUPPLY VOLTAGE-MIN: 3.135 V
SUPPLY VOLTAGE-NOM: 3.3 V
SURFACE MOUNT: YES
TERMINAL FINISH: TIN LEAD
TERMINAL FORM: BALL
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 25 MM
UPS/UCS/PERIPHERAL ICS TYPE: MICROPROCESSOR, RISC
Related Products
Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .