NT5CB64M16AP-BE

NT5CB64M16AP-BE

LFBGA, BGA96,9X16,32

Call for availability

Manufactured by:

NANYA TECHNOLOGY

Mfr Part#:  NT5CB64M16AP-BE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFBGA

PACKAGE DESCRIPTION:  LFBGA, BGA96,9X16,32

PACKAGE EQUIVALENCE CODE:  BGA96,9X16,32

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS MODE:  MULTI BANK PAGE BURST

ACCESS TIME-MAX:  300 PS

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

CLOCK FREQUENCY-MAX (FCLK):  533 MHZ

I/O TYPE:  COMMON

INTERLEAVED BURST LENGTH:  4,8

JESD-30 CODE:  R-PBGA-B96

LENGTH:  13 MM

MANUFACTURER:  NANYA TECHNOLOGY CORPORATION

MANUFACTURER PART NUMBER:  NT5CB64M16AP-BE

MEMORY DENSITY:  1.0737 GBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  96

NUMBER OF WORDS:  67.1089 M

NUMBER OF WORDS CODE:  64000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  64MX16

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFBGA

PACKAGE DESCRIPTION:  LFBGA, BGA96,9X16,32

PACKAGE EQUIVALENCE CODE:  BGA96,9X16,32

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  96

POWER SUPPLIES:  1.5 V

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  8192

SEATED HEIGHT-MAX:  1.39 MM

SEQUENTIAL BURST LENGTH:  4,8

STANDBY CURRENT-MAX:  16 MA

SUBCATEGORY:  DRAMS

SUPPLY CURRENT-MAX:  330 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  1.575 V

SUPPLY VOLTAGE-MIN (VSUP):  1.425 V

SUPPLY VOLTAGE-NOM (VSUP):  1.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  9 MM

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