NT5CC512M8DN-DII

NT5CC512M8DN-DII

VFBGA

Call for availability

Manufactured by:

NANYA TECHNOLOGY

Mfr Part#:  NT5CC512M8DN-DII

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VFBGA

PACKAGE DESCRIPTION:  VFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS MODE:  MULTI BANK PAGE BURST

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

JESD-30 CODE:  R-PBGA-B78

LENGTH:  10.5 MM

MANUFACTURER:  NANYA TECHNOLOGY CORPORATION

MANUFACTURER PART NUMBER:  NT5CC512M8DN-DII

MEMORY DENSITY:  4.295 GBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  78

NUMBER OF WORDS:  536.8709 M

NUMBER OF WORDS CODE:  512000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  512MX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VFBGA

PACKAGE DESCRIPTION:  VFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

SEATED HEIGHT-MAX:  1 MM

SUPPLY VOLTAGE-MAX (VSUP):  1.45 V

SUPPLY VOLTAGE-MIN (VSUP):  1.283 V

SUPPLY VOLTAGE-NOM (VSUP):  1.35 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  9 MM

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