74AHC1G126GV,125
TSSOP, TSOP5/6,.11,37Call for availability
Mfr Part#: 74AHC1G126GV,125
MANUFACTURER PACKAGE CODE: SOT753
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSOP5/6,.11,37
PACKAGE EQUIVALENCE CODE: TSOP5/6,.11,37
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PACKING METHOD: TAPE AND REEL
PART PACKAGE CODE: TSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
BRAND NAME: NXP SEMICONDUCTOR
CONTROL TYPE: ENABLE HIGH
FAMILY: AHC/VHC/H/U/V
JESD-30 CODE: R-PDSO-G5
JESD-609 CODE: E3
KEYWORDS: 9352 716 62125
LENGTH: 2.9 MM
LOAD CAPACITANCE (CL): 50 PF
LOGIC IC TYPE: BUS DRIVER
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PACKAGE CODE: SOT753
MANUFACTURER PART NUMBER: 74AHC1G126GV,125
MAX I(OL): 8 MA
MOISTURE SENSITIVITY LEVEL: 1
NUMBER OF BITS: 1
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 2
NUMBER OF TERMINALS: 5
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -40 °C
OUTPUT CHARACTERISTICS: 3-STATE
OUTPUT POLARITY: TRUE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSOP5/6,.11,37
PACKAGE EQUIVALENCE CODE: TSOP5/6,.11,37
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PACKING METHOD: TAPE AND REEL
PART PACKAGE CODE: TSOP
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 5
POWER SUPPLIES: 2/5.5 V
PROP. DELAY@NOM-SUP: 9.5 NS
PROPAGATION DELAY (TPD): 14.5 NS
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.1 MM
SUBCATEGORY: BUS DRIVER/TRANSCEIVERS
SUPPLY VOLTAGE-MAX (VSUP): 5.5 V
SUPPLY VOLTAGE-MIN (VSUP): 2 V
SUPPLY VOLTAGE-NOM (VSUP): 5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: AUTOMOTIVE
TERMINAL FINISH: TIN (SN)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 950 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 1.5 MM
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