FAMILY:  AUP/ULP/V

JESD-30 CODE:  R-PDSO-G5

JESD-609 CODE:  E3

LENGTH:  2.05 MM

LOAD CAPACITANCE (CL):  30 PF

LOGIC IC TYPE:  BUFFER

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  74AUP1G07GW

MAX I(OL):  1.7 MA

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF INPUTS:  1

NUMBER OF TERMINALS:  5

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -40 °C

OUTPUT CHARACTERISTICS:  OPEN-DRAIN

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP5/6,.08

PACKAGE EQUIVALENCE CODE:  TSSOP5/6,.08

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOT

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  5

POWER SUPPLIES:  1.2/3.3 V

PROP. DELAY@NOM-SUP:  13 NS

PROPAGATION DELAY (TPD):  20.7 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SCHMITT TRIGGER:  NO

SEATED HEIGHT-MAX:  1.1 MM

SOURCE URL STATUS CHECK DATE:  2013-06-14 00:00:00

SUBCATEGORY:  GATES

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  800 MV

SUPPLY VOLTAGE-NOM (VSUP):  1.1 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  AUTOMOTIVE

TERMINAL FINISH:  TIN (SN)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  1.25 MM