BRAND NAME:  NXP SEMICONDUCTOR

FAMILY:  HC/UH

JESD-30 CODE:  R-PDSO-G5

JESD-609 CODE:  E3

KEYWORDS:  9352 720 10125

LENGTH:  2.9 MM

LOAD CAPACITANCE (CL):  50 PF

LOGIC IC TYPE:  NAND GATE

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PACKAGE CODE:  SOT753

MANUFACTURER PART NUMBER:  74HC1G00GV,125

MAX I(OL):  2 MA

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF INPUTS:  2

NUMBER OF TERMINALS:  5

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSOP5/6,.11,37

PACKAGE EQUIVALENCE CODE:  TSOP5/6,.11,37

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PACKING METHOD:  TAPE AND REEL

PART PACKAGE CODE:  TSOP

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  5

POWER SUPPLIES:  2/6 V

PROP. DELAY@NOM-SUP:  27 NS

PROPAGATION DELAY (TPD):  135 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SCHMITT TRIGGER:  NO

SEATED HEIGHT-MAX:  1.1 MM

SUBCATEGORY:  GATES

SUPPLY VOLTAGE-MAX (VSUP):  6 V

SUPPLY VOLTAGE-MIN (VSUP):  2 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  AUTOMOTIVE

TERMINAL FINISH:  TIN (SN)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  950 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  1.5 MM