74HC2G125DC,125
VSSOP, TSSOP8,.12,20Call for availability
Mfr Part#: 74HC2G125DC,125
MANUFACTURER PACKAGE CODE: SOT765-1
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: VSSOP
PACKAGE DESCRIPTION: VSSOP, TSSOP8,.12,20
PACKAGE EQUIVALENCE CODE: TSSOP8,.12,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
PACKING METHOD: TAPE AND REEL
PART PACKAGE CODE: SSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
BRAND NAME: NXP SEMICONDUCTOR
CONTROL TYPE: ENABLE LOW
FAMILY: HC/UH
JESD-30 CODE: R-PDSO-G8
JESD-609 CODE: E4
KEYWORDS: 9352 747 15125
LENGTH: 2.3 MM
LOGIC IC TYPE: BUS DRIVER
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PACKAGE CODE: SOT765-1
MANUFACTURER PART NUMBER: 74HC2G125DC,125
MAX I(OL): 6 MA
MOISTURE SENSITIVITY LEVEL: 1
NUMBER OF BITS: 1
NUMBER OF FUNCTIONS: 2
NUMBER OF PORTS: 2
NUMBER OF TERMINALS: 8
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -40 °C
OUTPUT CHARACTERISTICS: 3-STATE
OUTPUT POLARITY: TRUE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: VSSOP
PACKAGE DESCRIPTION: VSSOP, TSSOP8,.12,20
PACKAGE EQUIVALENCE CODE: TSSOP8,.12,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
PACKING METHOD: TAPE AND REEL
PART PACKAGE CODE: SSOP
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 8
POWER SUPPLIES: 2/6 V
PROP. DELAY@NOM-SUP: 27 NS
PROPAGATION DELAY (TPD): 135 NS
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1 MM
SUBCATEGORY: BUS DRIVER/TRANSCEIVERS
SUPPLY VOLTAGE-MAX (VSUP): 6 V
SUPPLY VOLTAGE-MIN (VSUP): 2 V
SUPPLY VOLTAGE-NOM (VSUP): 5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: AUTOMOTIVE
TERMINAL FINISH: NICKEL/PALLADIUM/GOLD (NI/PD/AU)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 2 MM
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