74HC2G125DC,125

74HC2G125DC,125

VSSOP, TSSOP8,.12,20

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  74HC2G125DC,125

MANUFACTURER PACKAGE CODE:  SOT765-1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VSSOP

PACKAGE DESCRIPTION:  VSSOP, TSSOP8,.12,20

PACKAGE EQUIVALENCE CODE:  TSSOP8,.12,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

PACKING METHOD:  TAPE AND REEL

PART PACKAGE CODE:  SSOP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

BRAND NAME:  NXP SEMICONDUCTOR

CONTROL TYPE:  ENABLE LOW

FAMILY:  HC/UH

JESD-30 CODE:  R-PDSO-G8

JESD-609 CODE:  E4

KEYWORDS:  9352 747 15125

LENGTH:  2.3 MM

LOGIC IC TYPE:  BUS DRIVER

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PACKAGE CODE:  SOT765-1

MANUFACTURER PART NUMBER:  74HC2G125DC,125

MAX I(OL):  6 MA

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF BITS:  1

NUMBER OF FUNCTIONS:  2

NUMBER OF PORTS:  2

NUMBER OF TERMINALS:  8

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -40 °C

OUTPUT CHARACTERISTICS:  3-STATE

OUTPUT POLARITY:  TRUE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VSSOP

PACKAGE DESCRIPTION:  VSSOP, TSSOP8,.12,20

PACKAGE EQUIVALENCE CODE:  TSSOP8,.12,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

PACKING METHOD:  TAPE AND REEL

PART PACKAGE CODE:  SSOP

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  8

POWER SUPPLIES:  2/6 V

PROP. DELAY@NOM-SUP:  27 NS

PROPAGATION DELAY (TPD):  135 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1 MM

SUBCATEGORY:  BUS DRIVER/TRANSCEIVERS

SUPPLY VOLTAGE-MAX (VSUP):  6 V

SUPPLY VOLTAGE-MIN (VSUP):  2 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  AUTOMOTIVE

TERMINAL FINISH:  NICKEL/PALLADIUM/GOLD (NI/PD/AU)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  2 MM

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