74HC2G14GW,125
TSSOPCall for availability
Mfr Part#: 74HC2G14GW,125
MANUFACTURER PACKAGE CODE: SOT363
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP,
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PART PACKAGE CODE: TSSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
BRAND NAME: NXP SEMICONDUCTOR
FAMILY: HC/UH
JESD-30 CODE: R-PDSO-G6
JESD-609 CODE: E3
KEYWORDS: 9352 810 21125
LENGTH: 2 MM
LOGIC IC TYPE: INVERTER
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PACKAGE CODE: SOT363
MANUFACTURER PART NUMBER: 74HC2G14GW,125
MOISTURE SENSITIVITY LEVEL: 1
NUMBER OF FUNCTIONS: 2
NUMBER OF INPUTS: 1
NUMBER OF TERMINALS: 6
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP,
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PART PACKAGE CODE: TSSOP
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 6
PROPAGATION DELAY (TPD): 190 NS
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.1 MM
SUPPLY VOLTAGE-MAX (VSUP): 6 V
SUPPLY VOLTAGE-MIN (VSUP): 2 V
SUPPLY VOLTAGE-NOM (VSUP): 5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: AUTOMOTIVE
TERMINAL FINISH: TIN (SN)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 650 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 1.25 MM
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