74HC2G14GW,125

74HC2G14GW,125

TSSOP

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  74HC2G14GW,125

MANUFACTURER PACKAGE CODE:  SOT363

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

BRAND NAME:  NXP SEMICONDUCTOR

FAMILY:  HC/UH

JESD-30 CODE:  R-PDSO-G6

JESD-609 CODE:  E3

KEYWORDS:  9352 810 21125

LENGTH:  2 MM

LOGIC IC TYPE:  INVERTER

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PACKAGE CODE:  SOT363

MANUFACTURER PART NUMBER:  74HC2G14GW,125

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  2

NUMBER OF INPUTS:  1

NUMBER OF TERMINALS:  6

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  6

PROPAGATION DELAY (TPD):  190 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.1 MM

SUPPLY VOLTAGE-MAX (VSUP):  6 V

SUPPLY VOLTAGE-MIN (VSUP):  2 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  AUTOMOTIVE

TERMINAL FINISH:  TIN (SN)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  1.25 MM

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