74HC366PW
TSSOP, TSSOP16,.25Call for availability
Mfr Part#: 74HC366PW
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP16,.25
PACKAGE EQUIVALENCE CODE: TSSOP16,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PACKING METHOD: TUBE
PART PACKAGE CODE: TSSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: WITH DUAL OUTPUT ENABLE
CONTROL TYPE: ENABLE LOW
FAMILY: HC/UH
JESD-30 CODE: R-PDSO-G16
JESD-609 CODE: E4
LENGTH: 5 MM
LOAD CAPACITANCE (CL): 50 PF
LOGIC IC TYPE: BUS DRIVER
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PART NUMBER: 74HC366PW
MAX I(OL): 6 MA
MOISTURE SENSITIVITY LEVEL: 1
NUMBER OF BITS: 6
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 2
NUMBER OF TERMINALS: 16
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -40 °C
OUTPUT CHARACTERISTICS: 3-STATE
OUTPUT POLARITY: INVERTED
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP16,.25
PACKAGE EQUIVALENCE CODE: TSSOP16,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PACKING METHOD: TUBE
PART PACKAGE CODE: TSSOP
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 16
POWER SUPPLIES: 2/6 V
PROP. DELAY@NOM-SUP: 30 NS
PROPAGATION DELAY (TPD): 150 NS
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.1 MM
SUBCATEGORY: BUS DRIVER/TRANSCEIVERS
SUPPLY VOLTAGE-MAX (VSUP): 6 V
SUPPLY VOLTAGE-MIN (VSUP): 2 V
SUPPLY VOLTAGE-NOM (VSUP): 5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: AUTOMOTIVE
TERMINAL FINISH: NICKEL/PALLADIUM/GOLD (NI/PD/AU)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 650 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 4.4 MM
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