74HC573D
SOP, SOP20,.4Call for availability
Mfr Part#: 74HC573D
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: SOP
PACKAGE DESCRIPTION: SOP, SOP20,.4
PACKAGE EQUIVALENCE CODE: SOP20,.4
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE
PACKING METHOD: BULK PACK
PART PACKAGE CODE: SOIC
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: BROADSIDE VERSION OF 373
FAMILY: HC/UH
JESD-30 CODE: R-PDSO-G20
JESD-609 CODE: E4
LENGTH: 12.8 MM
LOAD CAPACITANCE (CL): 50 PF
LOGIC IC TYPE: BUS DRIVER
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PART NUMBER: 74HC573D
MAX I(OL): 6 MA
MOISTURE SENSITIVITY LEVEL: 1
NUMBER OF BITS: 8
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 2
NUMBER OF TERMINALS: 20
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -40 °C
OUTPUT CHARACTERISTICS: 3-STATE
OUTPUT POLARITY: TRUE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: SOP
PACKAGE DESCRIPTION: SOP, SOP20,.4
PACKAGE EQUIVALENCE CODE: SOP20,.4
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE
PACKING METHOD: BULK PACK
PART PACKAGE CODE: SOIC
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 20
POWER SUPPLIES: 2/6 V
PROP. DELAY@NOM-SUP: 45 NS
PROPAGATION DELAY (TPD): 225 NS
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 2.65 MM
SUBCATEGORY: FF/LATCHES
SUPPLY VOLTAGE-MAX (VSUP): 6 V
SUPPLY VOLTAGE-MIN (VSUP): 2 V
SUPPLY VOLTAGE-NOM (VSUP): 5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: AUTOMOTIVE
TERMINAL FINISH: NICKEL/PALLADIUM/GOLD (NI/PD/AU)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 7.5 MM
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